4,4'-Oxybis[(methoxymethyl)benzene]
≥97%
- Product Code: 118365
CAS:
2509-26-4
| Molecular Weight: | 258.32 g./mol | Molecular Formula: | C₁₆H₁₈O₃ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00082840 | |
| Melting Point: | Boiling Point: | 161°C/2mmHg(lit.) | |
| Density: | Storage Condition: | room temperature, dry |
Product Description:
Used primarily as a reactive diluent in epoxy resin formulations, it helps reduce viscosity, improving processing and application. It enhances the flexibility and adhesion of coatings, making it suitable for use in paints, varnishes, and adhesives. Additionally, it acts as a crosslinking agent in polymer systems, contributing to the durability and chemical resistance of final products. Its application extends to the electronics industry, where it is used in encapsulants and potting compounds to protect sensitive components.
Product Specification:
| Test | Specification |
|---|---|
| Appearance | Colorless To Light Yellow To Light Orange Clear Liquid |
| Purity (%) | 96.5-100 |
| Infrared Spectrum | Conforms To Structure |
| NMR | Conforms To Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 5.000 | 10-20 days | £56.32 |
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4,4'-Oxybis[(methoxymethyl)benzene]
Used primarily as a reactive diluent in epoxy resin formulations, it helps reduce viscosity, improving processing and application. It enhances the flexibility and adhesion of coatings, making it suitable for use in paints, varnishes, and adhesives. Additionally, it acts as a crosslinking agent in polymer systems, contributing to the durability and chemical resistance of final products. Its application extends to the electronics industry, where it is used in encapsulants and potting compounds to protect sensitive components.
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