3,3'-Diamino-4,4'-dihydroxydiphenyl sulfone
95%
- Product Code: 122272
CAS:
7545-50-8
| Molecular Weight: | 280.3 g./mol | Molecular Formula: | C₁₂H₁₂N₂O₄S |
|---|---|---|---|
| EC Number: | MDL Number: | ||
| Melting Point: | Boiling Point: | 596.9°C | |
| Density: | Storage Condition: | 2-8°C |
Product Description:
Used primarily in the production of high-performance polymers and resins, particularly in the synthesis of polybenzimidazoles and polyimides, which are known for their exceptional thermal stability and mechanical strength. These materials are widely applied in aerospace, automotive, and electronics industries for components that require resistance to extreme temperatures and harsh environments. Additionally, it serves as a key intermediate in the manufacture of dyes and pigments, offering enhanced colorfastness and durability in textile and coating applications. Its role in cross-linking agents for epoxy resins also contributes to improved adhesion and chemical resistance in composite materials.
Product Specification:
| Test | Specification |
|---|---|
| Appearance | Pale-yellow Solid |
| Purity (%) | 94.5-100 |
| Infrared Spectrum | Conforms To Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 0.250 | 10-20 days | $15.50 |
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| 1.000 | 10-20 days | $19.26 |
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| 5.000 | 10-20 days | $57.77 |
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| 25.000 | 10-20 days | $178.46 |
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| 100.000 | 10-20 days | $626.97 |
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3,3'-Diamino-4,4'-dihydroxydiphenyl sulfone
Used primarily in the production of high-performance polymers and resins, particularly in the synthesis of polybenzimidazoles and polyimides, which are known for their exceptional thermal stability and mechanical strength. These materials are widely applied in aerospace, automotive, and electronics industries for components that require resistance to extreme temperatures and harsh environments. Additionally, it serves as a key intermediate in the manufacture of dyes and pigments, offering enhanced colorfastness and durability in textile and coating applications. Its role in cross-linking agents for epoxy resins also contributes to improved adhesion and chemical resistance in composite materials.
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