(oxybis(4,1-phenylene))bis(dimethylsilane)
95%
- Product Code: 126850
Alias:
4,4'-Dimethylphenylene ether silane
CAS:
13315-17-8
| Molecular Weight: | 286.52 g./mol | Molecular Formula: | C₁₆H₂₂OSi₂ |
|---|---|---|---|
| EC Number: | MDL Number: | ||
| Melting Point: | 25ºC | Boiling Point: | 138ºC |
| Density: | 0.976g/mL | Storage Condition: | 2~8℃ |
Product Description:
Used primarily in the production of advanced polymeric materials, this compound serves as a key intermediate in synthesizing high-performance polymers and resins. Its unique structure contributes to the development of materials with enhanced thermal stability and mechanical strength, making it valuable in industries requiring durable coatings, adhesives, and composites. Additionally, it is employed in the creation of specialized silicone-based products, where its properties improve flexibility and resistance to environmental stressors. The compound also finds application in electronic materials, aiding in the production of components with superior insulation and heat resistance.
Product Specification:
| Test | Specification |
|---|---|
| Purity (GC) | 94.5-100 |
| Appearance | Colorless Liquid |
| Infrared Spectrum | Conforms To Structure |
| Note | This Product Is Low Melting Point Solid, May Change State In Different Environments (Solid, Liquid Or Semi-Solid) |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 1.000 | 10-20 days | $43.11 |
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| 5.000 | 10-20 days | $173.30 |
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| 25.000 | 10-20 days | $781.11 |
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(oxybis(4,1-phenylene))bis(dimethylsilane)
Used primarily in the production of advanced polymeric materials, this compound serves as a key intermediate in synthesizing high-performance polymers and resins. Its unique structure contributes to the development of materials with enhanced thermal stability and mechanical strength, making it valuable in industries requiring durable coatings, adhesives, and composites. Additionally, it is employed in the creation of specialized silicone-based products, where its properties improve flexibility and resistance to environmental stressors. The compound also finds application in electronic materials, aiding in the production of components with superior insulation and heat resistance.
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