Methyl nadic anhydride
≥95.0% , mixture of isomers
- Product Code: 52602
Alias:
Methyl-3.6-endomethylenetetrahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, 3-methylendomethylenetetrahydrophthalic anhydride, 3A,4,7,7A-tetrahydrophthalic anhydride Hydromethyl-4,7-methyleneisobenzofuran-1,3-dione
CAS:
25134-21-8
| Molecular Weight: | 178.18 g./mol | Molecular Formula: | C₁₀H₁₀O₃ |
|---|---|---|---|
| EC Number: | 246-644-8 | MDL Number: | MFCD00167036 |
| Melting Point: | Boiling Point: | 140°C (10 mmHg) | |
| Density: | 1.232 g/mL at 25 °C(lit.) | Storage Condition: | room temperature, dry |
Product Description:
Methyl nadic anhydride is primarily used as a curing agent in epoxy resin systems. It enhances the thermal stability and mechanical properties of the cured epoxy, making it suitable for applications in high-performance composites, coatings, and adhesives. The chemical is particularly valued in the electronics industry for encapsulating and protecting sensitive components due to its excellent electrical insulation properties and resistance to heat. Additionally, it finds use in the aerospace and automotive sectors for manufacturing lightweight, durable materials that can withstand extreme conditions. Its compatibility with various resins and ability to improve the overall performance of polymer systems make it a versatile choice in advanced material engineering.
Product Specification:
| Test | Specification |
|---|---|
| PurityGC | 95 100% |
| REFRACTIVE INDEX N20D | 1.506-1.508 |
| SPECIFIC GRAVITY 2020C | 1.23-1.24 |
| APPEARANCE | Colorless to light yellow liquid |
| INFRARED SPECTRUM | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 25.000 | 10-20 days | ฿470.00 |
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| 100.000 | 10-20 days | ฿1,000.00 |
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| 500.000 | 10-20 days | ฿4,120.00 |
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| 2500.000 | 10-20 days | ฿18,950.00 |
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Methyl nadic anhydride
Methyl nadic anhydride is primarily used as a curing agent in epoxy resin systems. It enhances the thermal stability and mechanical properties of the cured epoxy, making it suitable for applications in high-performance composites, coatings, and adhesives. The chemical is particularly valued in the electronics industry for encapsulating and protecting sensitive components due to its excellent electrical insulation properties and resistance to heat. Additionally, it finds use in the aerospace and automotive sectors for manufacturing lightweight, durable materials that can withstand extreme conditions. Its compatibility with various resins and ability to improve the overall performance of polymer systems make it a versatile choice in advanced material engineering.
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