(3-Glycidyloxypropyl)triethoxysilane
98%
- Product Code: 63685
Alias:
Triethoxy (3-oxiranylmethoxy) propyl silane; 3-glycidoxy propyl triethoxy silane; Γ-glycidyl ether oxypropyl triethoxy silane; 3 -(2,3-Glycidoxy)propyltriethoxysilane;3-Glycidoxypropylmethyltriethoxysilane;Γ-Glycidoxypropyltriethoxysilane ;Triethoxy(3-epoxypropylpropoxy)silane
CAS:
2602-34-8
Molecular Weight: | 278.42 g./mol | Molecular Formula: | C₁₂H₂₆O₅Si |
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EC Number: | 220-011-6 | MDL Number: | MFCD01311705 |
Melting Point: | -50°C | Boiling Point: | 270°C |
Density: | 1.004 g/mL at 20 °C(lit.) | Storage Condition: | room temperature |
Product Description:
Widely used as a coupling agent in various industries, this chemical enhances the adhesion between organic polymers and inorganic materials. In the coatings and adhesives sector, it improves the durability and performance of products by promoting strong bonds at the interface. It is also employed in the production of composites, where it strengthens the interaction between fibers and resin matrices, leading to materials with enhanced mechanical properties. Additionally, it serves as a surface modifier in glass and mineral fillers, improving their compatibility with polymer systems. In electronics, it is utilized to enhance the adhesion of encapsulants and coatings to substrates, ensuring better protection and reliability of electronic components. Its versatility makes it a valuable component in the formulation of high-performance materials across multiple applications.
Product Specification:
Test | Specification |
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PurityGC | 97.5 100% |
SPECIFIC GRAVITY 2020 | 1.005-1.009 |
REFRACTIVE INDEX N20D | 1.425-1.429 |
Appearance | COLORLESS LIQUID |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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1.000 | 10-20 days | $10.38 |
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5.000 | 10-20 days | $12.04 |
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25.000 | 10-20 days | $18.27 |
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100.000 | 10-20 days | $32.39 |
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500.000 | 10-20 days | $119.19 |
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(3-Glycidyloxypropyl)triethoxysilane
Widely used as a coupling agent in various industries, this chemical enhances the adhesion between organic polymers and inorganic materials. In the coatings and adhesives sector, it improves the durability and performance of products by promoting strong bonds at the interface. It is also employed in the production of composites, where it strengthens the interaction between fibers and resin matrices, leading to materials with enhanced mechanical properties. Additionally, it serves as a surface modifier in glass and mineral fillers, improving their compatibility with polymer systems. In electronics, it is utilized to enhance the adhesion of encapsulants and coatings to substrates, ensuring better protection and reliability of electronic components. Its versatility makes it a valuable component in the formulation of high-performance materials across multiple applications.
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