(3-Glycidyloxypropyl)triethoxysilane

98%

  • Product Code: 63685
  Alias:    Triethoxy (3-oxiranylmethoxy) propyl silane; 3-glycidoxy propyl triethoxy silane; Γ-glycidyl ether oxypropyl triethoxy silane; 3 -(2,3-Glycidoxy)propyltriethoxysilane;3-Glycidoxypropylmethyltriethoxysilane;Γ-Glycidoxypropyltriethoxysilane ;Triethoxy(3-epoxypropylpropoxy)silane
  CAS:    2602-34-8
Molecular Weight: 278.42 g./mol Molecular Formula: C₁₂H₂₆O₅Si
EC Number: 220-011-6 MDL Number: MFCD01311705
Melting Point: -50°C Boiling Point: 270°C
Density: 1.004 g/mL at 20 °C(lit.) Storage Condition: room temperature
Product Description: Widely used as a coupling agent in various industries, this chemical enhances the adhesion between organic polymers and inorganic materials. In the coatings and adhesives sector, it improves the durability and performance of products by promoting strong bonds at the interface. It is also employed in the production of composites, where it strengthens the interaction between fibers and resin matrices, leading to materials with enhanced mechanical properties. Additionally, it serves as a surface modifier in glass and mineral fillers, improving their compatibility with polymer systems. In electronics, it is utilized to enhance the adhesion of encapsulants and coatings to substrates, ensuring better protection and reliability of electronic components. Its versatility makes it a valuable component in the formulation of high-performance materials across multiple applications.
Product Specification:
Test Specification
PurityGC 97.5 100%
SPECIFIC GRAVITY 2020 1.005-1.009
REFRACTIVE INDEX N20D 1.425-1.429
Appearance COLORLESS LIQUID
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
1.000 10-20 days $10.38
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5.000 10-20 days $12.04
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25.000 10-20 days $18.27
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100.000 10-20 days $32.39
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500.000 10-20 days $119.19
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(3-Glycidyloxypropyl)triethoxysilane
Widely used as a coupling agent in various industries, this chemical enhances the adhesion between organic polymers and inorganic materials. In the coatings and adhesives sector, it improves the durability and performance of products by promoting strong bonds at the interface. It is also employed in the production of composites, where it strengthens the interaction between fibers and resin matrices, leading to materials with enhanced mechanical properties. Additionally, it serves as a surface modifier in glass and mineral fillers, improving their compatibility with polymer systems. In electronics, it is utilized to enhance the adhesion of encapsulants and coatings to substrates, ensuring better protection and reliability of electronic components. Its versatility makes it a valuable component in the formulation of high-performance materials across multiple applications.
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