n-Propyltriethoxysilane
97%
- Product Code: 63750
Alias:
N-Propyltriethoxysilane
CAS:
2550-02-9
| Molecular Weight: | 206.35 g./mol | Molecular Formula: | C₉H₂₂O₃Si |
|---|---|---|---|
| EC Number: | 219-842-7 | MDL Number: | MFCD00026756 |
| Melting Point: | Boiling Point: | 179-180 °C(lit.) | |
| Density: | 0.892 g/mL at 25 °C(lit.) | Storage Condition: | Room temperature, dry, sealed |
Product Description:
Used as a coupling agent in the production of composites and adhesives, enhancing the bond between organic polymers and inorganic materials. Commonly applied in surface treatment of fillers and pigments to improve dispersion and compatibility in various matrices. Employed in the manufacture of moisture-curable sealants and coatings, providing excellent adhesion to substrates like glass, metals, and ceramics. Also utilized in the preparation of silica-based materials, where it acts as a precursor for modifying surface properties. Widely used in the electronics industry for insulating coatings and encapsulants due to its ability to form stable, hydrophobic layers.
Product Specification:
| Test | Specification |
|---|---|
| PurityGC | 97 100% |
| REFRACTIVE INDEX N20D | 1.391-1.3971 |
| SPECIFIC GRAVITY 2020C | 0.887-0.897 |
| APPEARANCE | COLORLESS LIQUID |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 5.000 | 10-20 days | $15.50 |
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| 25.000 | 10-20 days | $31.94 |
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| 100.000 | 10-20 days | $102.38 |
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| 500.000 | 10-20 days | $371.95 |
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| 2500.000 | 10-20 days | $1,005.03 |
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n-Propyltriethoxysilane
Used as a coupling agent in the production of composites and adhesives, enhancing the bond between organic polymers and inorganic materials. Commonly applied in surface treatment of fillers and pigments to improve dispersion and compatibility in various matrices. Employed in the manufacture of moisture-curable sealants and coatings, providing excellent adhesion to substrates like glass, metals, and ceramics. Also utilized in the preparation of silica-based materials, where it acts as a precursor for modifying surface properties. Widely used in the electronics industry for insulating coatings and encapsulants due to its ability to form stable, hydrophobic layers.
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