Tetrakis(4-ethynylphenyl)silane
98%
- Product Code: 64422
CAS:
1390641-82-3
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| Density: | Storage Condition: | 2-8℃ |
Product Description:
Tetrakis(4-ethynylphenyl)silane finds its primary application in the field of materials science, particularly in the development of advanced polymers and organic frameworks. Its unique structure, featuring multiple ethynyl groups attached to a silicon core, makes it a valuable building block for creating highly cross-linked networks. These networks are essential in the synthesis of porous materials, such as metal-organic frameworks (MOFs) and covalent organic frameworks (COFs), which are used for gas storage, separation, and catalysis. Additionally, the compound is utilized in the preparation of organic semiconductors and optoelectronic devices, where its ability to form stable, conjugated systems enhances electronic properties. Its application extends to the creation of high-performance coatings and adhesives, where the cross-linking capability improves durability and thermal stability.
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 0.050 | 10-20 days | ฿5,112.00 |
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| 0.250 | 10-20 days | ฿19,314.00 |
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Tetrakis(4-ethynylphenyl)silane
Tetrakis(4-ethynylphenyl)silane finds its primary application in the field of materials science, particularly in the development of advanced polymers and organic frameworks. Its unique structure, featuring multiple ethynyl groups attached to a silicon core, makes it a valuable building block for creating highly cross-linked networks. These networks are essential in the synthesis of porous materials, such as metal-organic frameworks (MOFs) and covalent organic frameworks (COFs), which are used for gas storage, separation, and catalysis. Additionally, the compound is utilized in the preparation of organic semiconductors and optoelectronic devices, where its ability to form stable, conjugated systems enhances electronic properties. Its application extends to the creation of high-performance coatings and adhesives, where the cross-linking capability improves durability and thermal stability.
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