3,6,9,12-Tetraoxatetradecane-1,14-diyl diacrylate
95%
- Product Code: 64541
CAS:
59256-52-9
| Molecular Weight: | 346.37 g./mol | Molecular Formula: | C₁₆H₂₆O₈ |
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| EC Number: | MDL Number: | MFCD32706469 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | 2-8°C, dry, sealed |
Product Description:
Primarily used in the production of crosslinked polymers, this chemical serves as a key monomer in the synthesis of advanced materials. Its diacrylate groups enable it to participate in polymerization reactions, forming networks that enhance the mechanical and thermal properties of the resulting polymers. It is often employed in the development of coatings, adhesives, and sealants, where its ability to create durable, flexible, and chemically resistant films is highly valued. Additionally, it finds application in the fabrication of hydrogels and biomedical devices due to its biocompatibility and ability to form stable, water-absorbing structures. In the electronics industry, it is utilized in the production of photoresists and encapsulation materials, contributing to the protection and performance of electronic components.
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 0.250 | 10-20 days | $2,548.32 |
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3,6,9,12-Tetraoxatetradecane-1,14-diyl diacrylate
Primarily used in the production of crosslinked polymers, this chemical serves as a key monomer in the synthesis of advanced materials. Its diacrylate groups enable it to participate in polymerization reactions, forming networks that enhance the mechanical and thermal properties of the resulting polymers. It is often employed in the development of coatings, adhesives, and sealants, where its ability to create durable, flexible, and chemically resistant films is highly valued. Additionally, it finds application in the fabrication of hydrogels and biomedical devices due to its biocompatibility and ability to form stable, water-absorbing structures. In the electronics industry, it is utilized in the production of photoresists and encapsulation materials, contributing to the protection and performance of electronic components.
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