Tetrakis(dimethylamino)titanium(IV)

99.9% metals basis

  • Product Code: 68475
  Alias:    TDMAT;Tetrakis(dimethylamino)titanium(IV);Tetrakis(dimethylamino)titanium
  CAS:    3275-24-9
Molecular Weight: 224.18 g./mol Molecular Formula: C₈H₂₄N₄Ti
EC Number: MDL Number: MFCD00014861
Melting Point: 4 °C Boiling Point: 50 °C/0.5 mmHg (lit.)
Density: 0.947 g/mL at 25 °C (lit.) Storage Condition: Room temperature, dry, sealed, inert gas
Product Description: Tetrakis(dimethylamino)titanium(IV) is primarily used in the field of chemical vapor deposition (CVD) and atomic layer deposition (ALD) processes. It serves as a precursor for depositing titanium-containing thin films, which are essential in the semiconductor industry for manufacturing integrated circuits and other electronic components. The compound is particularly valued for its ability to form high-purity titanium nitride (TiN) films, which are used as diffusion barriers and conductive layers in microelectronic devices. Additionally, it is employed in the production of optical coatings and as a catalyst in various organic synthesis reactions, contributing to the development of advanced materials and chemical products.
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
1.000 10-20 days €315.79
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Tetrakis(dimethylamino)titanium(IV)
Tetrakis(dimethylamino)titanium(IV) is primarily used in the field of chemical vapor deposition (CVD) and atomic layer deposition (ALD) processes. It serves as a precursor for depositing titanium-containing thin films, which are essential in the semiconductor industry for manufacturing integrated circuits and other electronic components. The compound is particularly valued for its ability to form high-purity titanium nitride (TiN) films, which are used as diffusion barriers and conductive layers in microelectronic devices. Additionally, it is employed in the production of optical coatings and as a catalyst in various organic synthesis reactions, contributing to the development of advanced materials and chemical products.
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