Triphenylsulfonium triflate
- Product Code: 73462
CAS:
66003-78-9
Molecular Weight: | 412.45 g./mol | Molecular Formula: | C₁₉H₁₅F₃O₃S₂ |
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EC Number: | MDL Number: | ||
Melting Point: | 133 - 137 °C - lit. | Boiling Point: | |
Density: | Storage Condition: | room temperature |
Product Description:
Used extensively in photolithography processes for semiconductor manufacturing, it serves as a photoacid generator (PAG) in photoresists. When exposed to ultraviolet (UV) light, it generates strong acids that catalyze the chemical changes needed to create precise patterns on silicon wafers. This is critical for producing microchips and other electronic components with high precision and miniaturization. Additionally, it finds applications in advanced materials research, particularly in the development of high-performance coatings and polymers that require controlled curing or cross-linking under light exposure. Its stability and efficiency make it a preferred choice in industries demanding high-resolution patterning and reliable performance.
Product Specification:
Test | Specification |
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APPEARANCE | White Powder |
Infrared spectrum | Conforms to Structure |
NMR | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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0.050 | 10-20 days | $35.71 |
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0.250 | 10-20 days | $90.53 |
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1.000 | 10-20 days | $152.83 |
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5.000 | 10-20 days | $415.29 |
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25.000 | 10-20 days | $1,353.85 |
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Triphenylsulfonium triflate
Used extensively in photolithography processes for semiconductor manufacturing, it serves as a photoacid generator (PAG) in photoresists. When exposed to ultraviolet (UV) light, it generates strong acids that catalyze the chemical changes needed to create precise patterns on silicon wafers. This is critical for producing microchips and other electronic components with high precision and miniaturization. Additionally, it finds applications in advanced materials research, particularly in the development of high-performance coatings and polymers that require controlled curing or cross-linking under light exposure. Its stability and efficiency make it a preferred choice in industries demanding high-resolution patterning and reliable performance.
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