N,N'-Dihydroxypyromellitimide
≥96%
- Product Code: 78808
CAS:
57583-53-6
Molecular Weight: | 248.15 g./mol | Molecular Formula: | C₁₀H₄N₂O₆ |
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EC Number: | MDL Number: | ||
Melting Point: | Boiling Point: | ||
Density: | Storage Condition: | room temperature, dry |
Product Description:
N,N'-Dihydroxypyromellitimide is primarily utilized in the synthesis of advanced polymers and resins. It serves as a key intermediate in the production of high-performance materials, particularly polyimides, which are known for their exceptional thermal stability and mechanical strength. These polyimides are extensively used in the electronics industry for manufacturing flexible printed circuit boards, insulating films, and coatings for semiconductors. Additionally, the compound is employed in the development of adhesives and sealants that require high resistance to heat and chemicals. Its role in creating durable and heat-resistant materials makes it valuable in aerospace and automotive applications, where components are often exposed to extreme conditions. Furthermore, N,N'-Dihydroxypyromellitimide is explored in research for potential use in energy storage systems, such as in the development of novel electrolytes for batteries, due to its unique chemical properties.
Product Specification:
Test | Specification |
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APPEARANCE | White to almost white to light yellow powder crystal |
PURITY | 95.5-100 |
Infrared spectrum | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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0.200 | 10-20 days | $105.67 |
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1.000 | 10-20 days | $469.17 |
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N,N'-Dihydroxypyromellitimide
N,N'-Dihydroxypyromellitimide is primarily utilized in the synthesis of advanced polymers and resins. It serves as a key intermediate in the production of high-performance materials, particularly polyimides, which are known for their exceptional thermal stability and mechanical strength. These polyimides are extensively used in the electronics industry for manufacturing flexible printed circuit boards, insulating films, and coatings for semiconductors. Additionally, the compound is employed in the development of adhesives and sealants that require high resistance to heat and chemicals. Its role in creating durable and heat-resistant materials makes it valuable in aerospace and automotive applications, where components are often exposed to extreme conditions. Furthermore, N,N'-Dihydroxypyromellitimide is explored in research for potential use in energy storage systems, such as in the development of novel electrolytes for batteries, due to its unique chemical properties.
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