Bis[4-(4-Aminophenoxy)Phenyl]Sulfone
≥97%
- Product Code: 81826
CAS:
13080-89-2
Molecular Weight: | 432.49 g./mol | Molecular Formula: | C₂₄H₂₀N₂O₄S |
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EC Number: | MDL Number: | MFCD00039155 | |
Melting Point: | 195 °C | Boiling Point: | |
Density: | Storage Condition: | 2-8°C |
Product Description:
Widely used in the production of high-performance polymers, particularly polyimides and polyamides, due to its ability to enhance thermal stability and mechanical strength. It serves as a key monomer in the synthesis of these polymers, which are essential in aerospace, electronics, and automotive industries for applications like insulation films, coatings, and structural components. Its chemical structure contributes to the polymers' resistance to high temperatures and harsh environments, making it valuable in manufacturing advanced materials for demanding applications. Additionally, it is utilized in the development of adhesives and composites, where durability and thermal resistance are critical.
Product Specification:
Test | Specification |
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APPEARANCE | White to Light yellow powder to crystal |
PURITY | 96.5-100 |
MELTING POINT | 194-197 |
Infrared spectrum | Conforms to Structure |
NMR | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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1.000 | 10-20 days | $36.55 |
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5.000 | 10-20 days | $137.05 |
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Bis[4-(4-Aminophenoxy)Phenyl]Sulfone
Widely used in the production of high-performance polymers, particularly polyimides and polyamides, due to its ability to enhance thermal stability and mechanical strength. It serves as a key monomer in the synthesis of these polymers, which are essential in aerospace, electronics, and automotive industries for applications like insulation films, coatings, and structural components. Its chemical structure contributes to the polymers' resistance to high temperatures and harsh environments, making it valuable in manufacturing advanced materials for demanding applications. Additionally, it is utilized in the development of adhesives and composites, where durability and thermal resistance are critical.
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