Bis[4-(2-hydroxyethoxy)phenyl] Sulfone
95 %
- Product Code: 81861
CAS:
27205-03-4
Molecular Weight: | 338.38 g./mol | Molecular Formula: | C₁₆H₁₈O₆S |
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EC Number: | MDL Number: | MFCD00130282 | |
Melting Point: | 179-183°C (Lit.) | Boiling Point: | |
Density: | Storage Condition: | room temperature, dry |
Product Description:
This chemical is primarily utilized in the production of high-performance polymers, particularly polyethersulfones (PES). These polymers exhibit excellent thermal stability, chemical resistance, and mechanical strength, making them suitable for applications in demanding environments. It is commonly used in the manufacture of membranes for ultrafiltration, gas separation, and dialysis due to its ability to form stable, porous structures. Additionally, it finds use in the electronics industry as a component in insulating materials and coatings that require high thermal and chemical resistance. Its application extends to the automotive and aerospace sectors, where it contributes to the development of lightweight, durable components.
Product Specification:
Test | Specification |
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APPEARANCE | White to Almost white powder to crystal |
PURITY | 94.5-100 |
Infrared spectrum | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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5.000 | 10-20 days | £10.40 |
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25.000 | 10-20 days | £31.44 |
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100.000 | 10-20 days | £73.73 |
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Bis[4-(2-hydroxyethoxy)phenyl] Sulfone
This chemical is primarily utilized in the production of high-performance polymers, particularly polyethersulfones (PES). These polymers exhibit excellent thermal stability, chemical resistance, and mechanical strength, making them suitable for applications in demanding environments. It is commonly used in the manufacture of membranes for ultrafiltration, gas separation, and dialysis due to its ability to form stable, porous structures. Additionally, it finds use in the electronics industry as a component in insulating materials and coatings that require high thermal and chemical resistance. Its application extends to the automotive and aerospace sectors, where it contributes to the development of lightweight, durable components.
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