1,3-Dimethoxy-1,1,3,3-Tetramethyl Disiloxane
97%
- Product Code: 88102
CAS:
18187-24-1
| Molecular Weight: | 194.377 g./mol | Molecular Formula: | C₆H₁₈O₃Si₂ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD01861727 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | 2~8℃,Seal |
Product Description:
Used as a key intermediate in the synthesis of silicone polymers, it contributes to the production of materials with desirable properties like flexibility, thermal stability, and water repellency.
Applied in the formulation of coatings and sealants, it enhances durability and resistance to environmental factors such as moisture and UV radiation.
In the electronics industry, it serves as a precursor for dielectric materials, aiding in the development of insulating layers for semiconductors and other components.
Also utilized in the creation of release agents for molding processes, ensuring smooth demolding and extending the lifespan of molds.
Its role in surface modification improves the performance of various substrates, making them more suitable for specific industrial applications.
Product Specification:
| Test | Specification |
|---|---|
| APPEARANCE | White Solid |
| PURITY | 96.5 100% |
| Infrared spectrum | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 1.000 | 10-20 days | Ft9,265.73 |
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| 5.000 | 10-20 days | Ft24,564.97 |
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| 25.000 | 10-20 days | Ft146,527.87 |
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1,3-Dimethoxy-1,1,3,3-Tetramethyl Disiloxane
Used as a key intermediate in the synthesis of silicone polymers, it contributes to the production of materials with desirable properties like flexibility, thermal stability, and water repellency.
Applied in the formulation of coatings and sealants, it enhances durability and resistance to environmental factors such as moisture and UV radiation.
In the electronics industry, it serves as a precursor for dielectric materials, aiding in the development of insulating layers for semiconductors and other components.
Also utilized in the creation of release agents for molding processes, ensuring smooth demolding and extending the lifespan of molds.
Its role in surface modification improves the performance of various substrates, making them more suitable for specific industrial applications.
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