1,4-Bis(triethoxysilyl)benzene
70% solution
- Product Code: 88110
Alias:
1,4-bis(triethoxysilyl)benzene; 1,4-bis(triethoxysilyl)benzene;
CAS:
2615-18-1
| Molecular Weight: | 402.63 g./mol | Molecular Formula: | C₁₈H₃₄O₆Si₂ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD05664351 | |
| Melting Point: | >0ºC | Boiling Point: | 130-133ºC0.5 mm Hg(lit.) |
| Density: | 1.015 g/mL3 | Storage Condition: | 2~8℃ |
Product Description:
Used as a coupling agent in the production of hybrid organic-inorganic materials, enhancing the adhesion between organic polymers and inorganic substrates. Commonly applied in coatings, adhesives, and sealants to improve mechanical properties and durability. It is also utilized in the synthesis of silica-based nanocomposites, where it acts as a bridging molecule to create stable, integrated structures. In the electronics industry, it serves as a surface modifier for semiconductors and glass, improving performance and reliability. Additionally, it plays a role in the development of advanced materials for optical and sensor applications due to its ability to form strong, uniform bonds.
Product Specification:
| Test | Specification |
|---|---|
| CONCENTRATION | 68-72 |
| Appearance | COLORLESS LIQUID |
| Infrared spectrum | Conforms to Structure |
| Proton NMR spectra | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 5.000 | 10-20 days | $190.67 |
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1,4-Bis(triethoxysilyl)benzene
Used as a coupling agent in the production of hybrid organic-inorganic materials, enhancing the adhesion between organic polymers and inorganic substrates. Commonly applied in coatings, adhesives, and sealants to improve mechanical properties and durability. It is also utilized in the synthesis of silica-based nanocomposites, where it acts as a bridging molecule to create stable, integrated structures. In the electronics industry, it serves as a surface modifier for semiconductors and glass, improving performance and reliability. Additionally, it plays a role in the development of advanced materials for optical and sensor applications due to its ability to form strong, uniform bonds.
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