Bis(diethylamino)dimetylsilane
95%
- Product Code: 88397
CAS:
4669-59-4
| Molecular Weight: | 202.41 g./mol | Molecular Formula: | C₁₀H₂₆N₂S |
|---|---|---|---|
| EC Number: | 225-116-0 | MDL Number: | |
| Melting Point: | Boiling Point: | 192 °C | |
| Density: | 0.826 g/cm3 | Storage Condition: | 2~8℃, dry, sealed |
Product Description:
Used as a precursor in the chemical vapor deposition (CVD) process to create thin films of silicon-based materials, particularly in the semiconductor industry. It aids in the production of silicon nitride and silicon carbide coatings, which are essential for enhancing the durability and performance of electronic components. Additionally, it serves as a key reagent in the synthesis of organosilicon compounds, which are widely utilized in the manufacture of adhesives, sealants, and coatings. Its role in surface modification processes is also significant, where it improves the adhesion and compatibility of materials in various industrial applications.
Product Specification:
| Test | Specification |
|---|---|
| Purity | 94.5-100 |
| APPEARANCE | Clear liquid |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 2.000 | 10-20 days | $31.46 |
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| 10.000 | 10-20 days | $112.08 |
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| 50.000 | 10-20 days | $397.19 |
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Bis(diethylamino)dimetylsilane
Used as a precursor in the chemical vapor deposition (CVD) process to create thin films of silicon-based materials, particularly in the semiconductor industry. It aids in the production of silicon nitride and silicon carbide coatings, which are essential for enhancing the durability and performance of electronic components. Additionally, it serves as a key reagent in the synthesis of organosilicon compounds, which are widely utilized in the manufacture of adhesives, sealants, and coatings. Its role in surface modification processes is also significant, where it improves the adhesion and compatibility of materials in various industrial applications.
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