Diethoxydiphenylsilane
98%
- Product Code: 88410
Alias:
Diphenyldiethoxysilane
CAS:
2553-19-7
Molecular Weight: | 272.42 g./mol | Molecular Formula: | C₁₆H₂₀O₂Si |
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EC Number: | 219-860-5 | MDL Number: | MFCD00015126 |
Melting Point: | Boiling Point: | 167 °C15 mm Hg(lit.) | |
Density: | 1.033 g/mL at 25 °C(lit.) | Storage Condition: | room temperature |
Product Description:
Diethoxydiphenylsilane is widely used in the synthesis of silicone-based polymers and resins. It serves as a key intermediate in the production of materials with high thermal stability and chemical resistance, making it valuable for coatings and sealants in industrial applications. Additionally, it is employed in the preparation of adhesives and encapsulants for electronic components, where durability and performance under harsh conditions are essential. Its role in modifying surface properties of materials, such as improving water repellency or enhancing adhesion, is also significant in various manufacturing processes.
Product Specification:
Test | Specification |
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PurityGC | 98 100% |
APPEARANCE | COLORLESS LIQUID |
INFRARED SPECTRUM | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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5.000 | 10-20 days | £17.19 |
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25.000 | 10-20 days | £67.17 |
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100.000 | 10-20 days | £182.75 |
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500.000 | 10-20 days | £818.96 |
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2500.000 | 10-20 days | £2,456.88 |
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Diethoxydiphenylsilane
Diethoxydiphenylsilane is widely used in the synthesis of silicone-based polymers and resins. It serves as a key intermediate in the production of materials with high thermal stability and chemical resistance, making it valuable for coatings and sealants in industrial applications. Additionally, it is employed in the preparation of adhesives and encapsulants for electronic components, where durability and performance under harsh conditions are essential. Its role in modifying surface properties of materials, such as improving water repellency or enhancing adhesion, is also significant in various manufacturing processes.
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