Copper Methane Sulfonate
36 wt. % in H2O
- Product Code: 94815
CAS:
54253-62-2
| Molecular Weight: | 253.74 g./mol | Molecular Formula: | C₂H₆CuO₆S₂ |
|---|---|---|---|
| EC Number: | MDL Number: | ||
| Melting Point: | 20ºC | Boiling Point: | |
| Density: | 1.511g/cm3 | Storage Condition: | room temperature, dry |
Product Description:
Copper methane sulfonate is widely used in the electronics industry as a key component in electroplating processes. It serves as an electrolyte in the deposition of copper onto various substrates, ensuring smooth, uniform, and high-quality copper layers. This is particularly important in the production of printed circuit boards (PCBs), where precise copper plating is essential for conductivity and performance. Additionally, it is utilized in the manufacturing of semiconductors and microelectronic devices, where it aids in creating fine copper traces and interconnects. Its stability and efficiency make it a preferred choice for advanced electroplating applications.
Product Specification:
| Test | Specification |
|---|---|
| APPEARANCE | Blue Clear Liquid |
| ASSAY | 36 wt. % |
| Infrared spectrum | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
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| 5.000 | 10-20 days | $44.20 |
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| 25.000 | 10-20 days | $110.50 |
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| 100.000 | 10-20 days | $267.20 |
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| 500.000 | 10-20 days | $713.21 |
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Copper Methane Sulfonate
Copper methane sulfonate is widely used in the electronics industry as a key component in electroplating processes. It serves as an electrolyte in the deposition of copper onto various substrates, ensuring smooth, uniform, and high-quality copper layers. This is particularly important in the production of printed circuit boards (PCBs), where precise copper plating is essential for conductivity and performance. Additionally, it is utilized in the manufacturing of semiconductors and microelectronic devices, where it aids in creating fine copper traces and interconnects. Its stability and efficiency make it a preferred choice for advanced electroplating applications.
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