Dipentaerythritol Hexakis(3-mercaptopropionate)
≥93%
- Product Code: 95112
CAS:
25359-71-1
| Molecular Weight: | 783.02 g./mol | Molecular Formula: | C₂₈H₄₆O₁₃S₆ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00128217 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | room temperature, dry |
Product Description:
Dipentaerythritol Hexakis(3-mercaptopropionate) is widely used as a crosslinking agent in the production of high-performance polymers and resins. Its multiple thiol groups enable it to form strong, durable networks, making it ideal for applications in coatings, adhesives, and sealants where enhanced mechanical properties and chemical resistance are required. Additionally, it is employed in the synthesis of optical materials, such as lenses and films, due to its ability to create transparent, stable structures. In the electronics industry, it serves as a key component in the fabrication of encapsulants and insulating materials, providing protection against moisture and thermal stress. Its versatility also extends to the field of 3D printing, where it is used to improve the strength and flexibility of printed objects.
Product Specification:
| Test | Specification |
|---|---|
| APPEARANCE | COLORLESS TO PALE YELLOW LIQUID |
| PURITY | 92.5-100 |
| REFRACTURE INDEX N20D | 1.5310-1.5360 |
| SPECIFIC GRAVIY2020 | 1.2850-1.2900 |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 25.000 | 10-20 days | Ft27,797.20 |
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| 100.000 | 10-20 days | Ft77,573.58 |
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Dipentaerythritol Hexakis(3-mercaptopropionate)
Dipentaerythritol Hexakis(3-mercaptopropionate) is widely used as a crosslinking agent in the production of high-performance polymers and resins. Its multiple thiol groups enable it to form strong, durable networks, making it ideal for applications in coatings, adhesives, and sealants where enhanced mechanical properties and chemical resistance are required. Additionally, it is employed in the synthesis of optical materials, such as lenses and films, due to its ability to create transparent, stable structures. In the electronics industry, it serves as a key component in the fabrication of encapsulants and insulating materials, providing protection against moisture and thermal stress. Its versatility also extends to the field of 3D printing, where it is used to improve the strength and flexibility of printed objects.
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