1-(3-(Triethoxysilyl)propyl)-1H-pyrrole-2,5-dione
95%
- Product Code: 39762
CAS:
29602-11-7
| Molecular Weight: | 301.4100 g./mol | Molecular Formula: | C₁₃H₂₃NO₅Si |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD28978417 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | room temperature |
Product Description:
This chemical is primarily used as a coupling agent in the modification of surfaces, particularly in the field of materials science. It is applied to enhance the adhesion between organic polymers and inorganic materials, such as glass, metals, or ceramics. The compound is often utilized in the production of composite materials, where it improves the compatibility and bonding at the interface of different phases. Additionally, it is employed in coatings and adhesives to increase durability and performance. In the electronics industry, it serves as a surface modifier for improving the properties of semiconductors and other electronic components. Its ability to form strong, stable bonds makes it valuable in advanced material applications, including nanotechnology and biomedical devices.
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 0.250 | 10-20 days | ฿495.00 |
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1-(3-(Triethoxysilyl)propyl)-1H-pyrrole-2,5-dione
This chemical is primarily used as a coupling agent in the modification of surfaces, particularly in the field of materials science. It is applied to enhance the adhesion between organic polymers and inorganic materials, such as glass, metals, or ceramics. The compound is often utilized in the production of composite materials, where it improves the compatibility and bonding at the interface of different phases. Additionally, it is employed in coatings and adhesives to increase durability and performance. In the electronics industry, it serves as a surface modifier for improving the properties of semiconductors and other electronic components. Its ability to form strong, stable bonds makes it valuable in advanced material applications, including nanotechnology and biomedical devices.
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