eCF309
98%
- Product Code: 55371
CAS:
2001571-40-8
| Molecular Weight: | 383.4 g./mol | Molecular Formula: | C₁₈H₂₁N₇O₃ |
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| Density: | Storage Condition: | -20°C, airtight, dry |
Product Description:
eCF309 is primarily used in the electronics industry as a key component in the manufacturing of semiconductors and advanced electronic devices. It plays a critical role in the deposition process, enabling the creation of thin films with high precision and uniformity, which are essential for the performance of integrated circuits and microchips. Additionally, eCF309 is utilized in the production of flat-panel displays, where it helps enhance the quality and durability of the screens. Its application extends to photovoltaic cells, contributing to the efficiency and longevity of solar panels. In the field of nanotechnology, eCF309 is employed in the fabrication of nanostructures, facilitating advancements in miniaturized devices and sensors. Its versatility and effectiveness make it a valuable material in cutting-edge technological applications.
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 0.001 | 10-20 days | ฿50,607.00 |
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eCF309
eCF309 is primarily used in the electronics industry as a key component in the manufacturing of semiconductors and advanced electronic devices. It plays a critical role in the deposition process, enabling the creation of thin films with high precision and uniformity, which are essential for the performance of integrated circuits and microchips. Additionally, eCF309 is utilized in the production of flat-panel displays, where it helps enhance the quality and durability of the screens. Its application extends to photovoltaic cells, contributing to the efficiency and longevity of solar panels. In the field of nanotechnology, eCF309 is employed in the fabrication of nanostructures, facilitating advancements in miniaturized devices and sensors. Its versatility and effectiveness make it a valuable material in cutting-edge technological applications.
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