Monodisperesed silica micropheres

Particle size: 500nm, 2.5% w/v

  • Product Code: 59324
  CAS:    60676-86-0
Molecular Weight: 60.08 g./mol Molecular Formula: SiO₂
EC Number: 262-373-8 MDL Number: MFCD00011232
Melting Point: 1610 °C(lit.) Boiling Point:
Density: 0.47 g/cm3 (loose weight)(lit.) Storage Condition: room temperature
Product Description: Monodispersed silica microspheres are widely used in various industries due to their uniform size and high surface area. In the pharmaceutical sector, they serve as drug delivery carriers, enabling controlled release and targeted therapy. They are also employed in chromatography as stationary phases, enhancing separation efficiency and resolution. In the cosmetics industry, these microspheres are incorporated into formulations to improve texture, provide smoothness, and act as light diffusers. Additionally, they are utilized in coatings and paints to enhance durability, scratch resistance, and optical properties. In electronics, they are used as fillers in adhesives and encapsulants to improve thermal and mechanical performance. Their precision and consistency make them valuable in research and development for calibration standards and model systems in material science.
Product Specification:
Test Specification
PARTICLE SIZE 450-550
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
5.000 10-20 days ฿7,880.00
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Monodisperesed silica micropheres
Monodispersed silica microspheres are widely used in various industries due to their uniform size and high surface area. In the pharmaceutical sector, they serve as drug delivery carriers, enabling controlled release and targeted therapy. They are also employed in chromatography as stationary phases, enhancing separation efficiency and resolution. In the cosmetics industry, these microspheres are incorporated into formulations to improve texture, provide smoothness, and act as light diffusers. Additionally, they are utilized in coatings and paints to enhance durability, scratch resistance, and optical properties. In electronics, they are used as fillers in adhesives and encapsulants to improve thermal and mechanical performance. Their precision and consistency make them valuable in research and development for calibration standards and model systems in material science.
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