3-Aminopropyl(diethoxy)methylsilane
97%
- Product Code: 63650
Alias:
γ-Aminopropylmethyldiethoxysilane ;3-Aminopropylmethyldiethoxysilane
CAS:
3179-76-8
Molecular Weight: | 191.34 g./mol | Molecular Formula: | C₈H₂₁NO₂Si |
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EC Number: | 221-660-8 | MDL Number: | mfcd00039785 |
Melting Point: | Boiling Point: | 85-88 °C8 mm Hg(lit.) | |
Density: | 0.916 g/mL at 25 °C(lit.) | Storage Condition: | room temperature |
Product Description:
This chemical is widely used as a coupling agent in the production of composite materials, particularly in enhancing the adhesion between organic polymers and inorganic surfaces. It is commonly applied in the manufacturing of fiberglass and mineral-filled composites, where it improves the mechanical properties and durability of the final product. Additionally, it serves as a surface modifier in coatings and adhesives, promoting better bonding and resistance to environmental factors. In the electronics industry, it is utilized to treat surfaces of glass and silicon wafers, improving the performance of electronic components. Its versatility also extends to the field of nanotechnology, where it aids in the functionalization of nanoparticles for various advanced applications.
Product Specification:
Test | Specification |
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PurityGC | 97-100 |
REFRACTIVE INDEX N20D | 1.425-1.429 |
APPEARANCE | COLORLESS LIQUID |
INFRARED SPECTRUM | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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50.000 | 10-20 days | $15.00 |
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250.000 | 10-20 days | $46.20 |
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1000.000 | 10-20 days | $147.61 |
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5000.000 | 10-20 days | $688.87 |
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3-Aminopropyl(diethoxy)methylsilane
This chemical is widely used as a coupling agent in the production of composite materials, particularly in enhancing the adhesion between organic polymers and inorganic surfaces. It is commonly applied in the manufacturing of fiberglass and mineral-filled composites, where it improves the mechanical properties and durability of the final product. Additionally, it serves as a surface modifier in coatings and adhesives, promoting better bonding and resistance to environmental factors. In the electronics industry, it is utilized to treat surfaces of glass and silicon wafers, improving the performance of electronic components. Its versatility also extends to the field of nanotechnology, where it aids in the functionalization of nanoparticles for various advanced applications.
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