3-Aminopropyl(diethoxy)methylsilane

97%

  • Product Code: 63650
  Alias:    γ-Aminopropylmethyldiethoxysilane ;3-Aminopropylmethyldiethoxysilane
  CAS:    3179-76-8
Molecular Weight: 191.34 g./mol Molecular Formula: C₈H₂₁NO₂Si
EC Number: 221-660-8 MDL Number: mfcd00039785
Melting Point: Boiling Point: 85-88 °C8 mm Hg(lit.)
Density: 0.916 g/mL at 25 °C(lit.) Storage Condition: room temperature
Product Description: This chemical is widely used as a coupling agent in the production of composite materials, particularly in enhancing the adhesion between organic polymers and inorganic surfaces. It is commonly applied in the manufacturing of fiberglass and mineral-filled composites, where it improves the mechanical properties and durability of the final product. Additionally, it serves as a surface modifier in coatings and adhesives, promoting better bonding and resistance to environmental factors. In the electronics industry, it is utilized to treat surfaces of glass and silicon wafers, improving the performance of electronic components. Its versatility also extends to the field of nanotechnology, where it aids in the functionalization of nanoparticles for various advanced applications.
Product Specification:
Test Specification
PurityGC 97-100
REFRACTIVE INDEX N20D 1.425-1.429
APPEARANCE COLORLESS LIQUID
INFRARED SPECTRUM Conforms to Structure
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
50.000 10-20 days $15.00
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250.000 10-20 days $46.20
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1000.000 10-20 days $147.61
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5000.000 10-20 days $688.87
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3-Aminopropyl(diethoxy)methylsilane
This chemical is widely used as a coupling agent in the production of composite materials, particularly in enhancing the adhesion between organic polymers and inorganic surfaces. It is commonly applied in the manufacturing of fiberglass and mineral-filled composites, where it improves the mechanical properties and durability of the final product. Additionally, it serves as a surface modifier in coatings and adhesives, promoting better bonding and resistance to environmental factors. In the electronics industry, it is utilized to treat surfaces of glass and silicon wafers, improving the performance of electronic components. Its versatility also extends to the field of nanotechnology, where it aids in the functionalization of nanoparticles for various advanced applications.
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