1-(4-(Trifluoromethyl)phenyl)-1H-pyrrole-2,5-dione
97%
- Product Code: 63783
CAS:
54647-09-5
| Molecular Weight: | 241.17 g./mol | Molecular Formula: | C₁₁H₆F₃NO₂ |
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| EC Number: | MDL Number: | MFCD00525927 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | Room temperature, dry, sealed |
Product Description:
This chemical is primarily utilized in organic synthesis and material science. It serves as a key intermediate in the production of advanced polymers and coatings, particularly those requiring enhanced thermal stability and chemical resistance. Its unique structure, featuring a trifluoromethyl group, makes it valuable in the development of specialty chemicals for electronics, where it contributes to the creation of high-performance dielectric materials. Additionally, it is employed in pharmaceutical research for designing novel drug candidates, especially in the development of anti-inflammatory and antimicrobial agents. Its role in crosslinking reactions also makes it useful in the formulation of adhesives and sealants, improving their durability and performance under harsh conditions.
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 0.100 | 10-20 days | ฿1,350.00 |
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| 0.250 | 10-20 days | ฿2,286.00 |
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| 1.000 | 10-20 days | ฿5,130.00 |
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1-(4-(Trifluoromethyl)phenyl)-1H-pyrrole-2,5-dione
This chemical is primarily utilized in organic synthesis and material science. It serves as a key intermediate in the production of advanced polymers and coatings, particularly those requiring enhanced thermal stability and chemical resistance. Its unique structure, featuring a trifluoromethyl group, makes it valuable in the development of specialty chemicals for electronics, where it contributes to the creation of high-performance dielectric materials. Additionally, it is employed in pharmaceutical research for designing novel drug candidates, especially in the development of anti-inflammatory and antimicrobial agents. Its role in crosslinking reactions also makes it useful in the formulation of adhesives and sealants, improving their durability and performance under harsh conditions.
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