N-Hydroxy-5-norbornene-2.3-dicarboxylic imide
99%
- Product Code: 65719
Alias:
N-Hydroxy-5-norbornane-2,3-diimide
CAS:
21715-90-2
| Molecular Weight: | 179.17 g./mol | Molecular Formula: | C₉H₉NO₃ |
|---|---|---|---|
| EC Number: | 244-538-6 | MDL Number: | MFCD00065691 |
| Melting Point: | 165-170 °C(lit.) | Boiling Point: | |
| Density: | Storage Condition: | room temperature |
Product Description:
N-Hydroxy-5-norbornene-2,3-dicarboxylic imide is primarily used in organic synthesis as a versatile reagent. It is often employed in the preparation of active esters, which are intermediates in peptide coupling reactions. This compound is also utilized in the development of polymers and resins, particularly in the creation of cross-linked materials with enhanced thermal and mechanical properties. Additionally, it finds application in the field of material science for surface modification and functionalization, improving adhesion and compatibility in composite materials. Its role in photoresist technology is notable, where it contributes to the production of high-resolution patterns in semiconductor manufacturing.
Product Specification:
| Test | Specification |
|---|---|
| Melting point | 167 172? |
| PURITYNEUTRALIZATION TITRATION | 98.5 101.5% |
| APPEARANCE | White solid |
| INFRARED SPECTRUM | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 2.000 | 10-20 days | ฿370.00 |
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| 10.000 | 10-20 days | ฿690.00 |
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| 50.000 | 10-20 days | ฿2,590.00 |
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| 250.000 | 10-20 days | ฿10,990.00 |
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N-Hydroxy-5-norbornene-2.3-dicarboxylic imide
N-Hydroxy-5-norbornene-2,3-dicarboxylic imide is primarily used in organic synthesis as a versatile reagent. It is often employed in the preparation of active esters, which are intermediates in peptide coupling reactions. This compound is also utilized in the development of polymers and resins, particularly in the creation of cross-linked materials with enhanced thermal and mechanical properties. Additionally, it finds application in the field of material science for surface modification and functionalization, improving adhesion and compatibility in composite materials. Its role in photoresist technology is notable, where it contributes to the production of high-resolution patterns in semiconductor manufacturing.
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