2,2'-Bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,1'-biimidazole
99%
- Product Code: 67804
Alias:
Photoinitiator BCIM
CAS:
1707-68-2
| Molecular Weight: | 659.61 g./mol | Molecular Formula: | C₄₂H₂₈Cl₂N₄ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00060081 | |
| Melting Point: | Boiling Point: | 823°C at 760 mmHg | |
| Density: | Storage Condition: | Room temperature, sealed, dry |
Product Description:
This chemical is primarily utilized as a photoinitiator in various polymerization processes, particularly in UV-curable coatings, inks, and adhesives. It plays a critical role in initiating the curing process when exposed to ultraviolet light, leading to the formation of durable and high-performance polymer films. Additionally, it is employed in the production of photoresists for the electronics industry, where it helps in creating precise patterns on semiconductor materials. Its ability to generate free radicals under UV exposure makes it a valuable component in advanced manufacturing and material science applications.
Product Specification:
| Test | Specification |
|---|---|
| APPEARANCE | Solid |
| PURITY | 98.5-100 |
| Infrared spectrum | Conforms to Structure |
| NMR | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 25.000 | 10-20 days | ฿2,080.00 |
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| 100.000 | 10-20 days | ฿4,660.00 |
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2,2'-Bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,1'-biimidazole
This chemical is primarily utilized as a photoinitiator in various polymerization processes, particularly in UV-curable coatings, inks, and adhesives. It plays a critical role in initiating the curing process when exposed to ultraviolet light, leading to the formation of durable and high-performance polymer films. Additionally, it is employed in the production of photoresists for the electronics industry, where it helps in creating precise patterns on semiconductor materials. Its ability to generate free radicals under UV exposure makes it a valuable component in advanced manufacturing and material science applications.
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