3,3'-((Sulfonylbis(4,1-phenylene))bis(oxy))dianiline
98%
- Product Code: 81862
CAS:
30203-11-3
Molecular Weight: | 432.49 g./mol | Molecular Formula: | C₂₄H₂₀N₂O₄S |
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EC Number: | MDL Number: | MFCD00054738 | |
Melting Point: | 132-135°C | Boiling Point: | 648.7°C |
Density: | Storage Condition: | room temperature, dry |
Product Description:
This chemical is primarily used in the synthesis of high-performance polymers, particularly polyimides and epoxy resins, which are valued for their thermal stability, mechanical strength, and chemical resistance. It serves as a key monomer in the production of these materials, making them suitable for applications in aerospace, electronics, and automotive industries. Additionally, it is utilized in the development of advanced coatings and adhesives that require durability under extreme conditions. Its incorporation into polymer matrices enhances properties such as heat resistance and mechanical integrity, making it essential for manufacturing components like circuit boards, insulation materials, and structural composites.
Product Specification:
Test | Specification |
---|---|
APPEARANCE | White to Green to Brown powder to crystal |
PURITY | 97.5-100 |
MELTING POINT | 134.0-137.0 |
Infrared spectrum | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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1.000 | 10-20 days | ฿390.00 |
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10.000 | 10-20 days | ฿740.00 |
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50.000 | 10-20 days | ฿2,350.00 |
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250.000 | 10-20 days | ฿7,460.00 |
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3,3'-((Sulfonylbis(4,1-phenylene))bis(oxy))dianiline
This chemical is primarily used in the synthesis of high-performance polymers, particularly polyimides and epoxy resins, which are valued for their thermal stability, mechanical strength, and chemical resistance. It serves as a key monomer in the production of these materials, making them suitable for applications in aerospace, electronics, and automotive industries. Additionally, it is utilized in the development of advanced coatings and adhesives that require durability under extreme conditions. Its incorporation into polymer matrices enhances properties such as heat resistance and mechanical integrity, making it essential for manufacturing components like circuit boards, insulation materials, and structural composites.
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