Tripropylene Glycol Diacrylate(stabilized with MEHQ)
90%(total of isomer)
- Product Code: 84335
Alias:
Tripropylene glycol diacrylate; Tri(1,2-propanediol) diacrylate;
CAS:
42978-66-5
Molecular Weight: | 300.35 g./mol | Molecular Formula: | C₁₅H₂₄O₆ |
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EC Number: | 256-032-2 | MDL Number: | MFCD00064598 |
Melting Point: | Boiling Point: | 368.9ºC | |
Density: | 1.03 g/cm3 | Storage Condition: | Room temperature, dry, sealed |
Product Description:
Tripropylene Glycol Diacrylate (stabilized with MEHQ) is widely used in the production of UV-curable coatings and inks. Its ability to rapidly polymerize under UV light makes it a key component in creating durable, high-performance finishes on various surfaces, including plastics, metals, and paper.
In the electronics industry, it is utilized in the fabrication of photoresists and solder masks, providing precise patterning and protection for circuit boards. Additionally, it serves as a crosslinking agent in adhesives and sealants, enhancing their strength and resistance to environmental factors.
The chemical is also employed in 3D printing resins, enabling the creation of detailed and robust prototypes or end-use parts. Its stabilized form ensures safe handling and storage during these applications.
Product Specification:
Test | Specification |
---|---|
Purity | 89.5 100% |
Appearance | COLORLESS TO PALE YELLOW LIQUID |
Infrared spectrum | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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5.000 | 10-20 days | ฿330.00 |
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25.000 | 10-20 days | ฿970.00 |
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100.000 | 10-20 days | ฿2,690.00 |
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500.000 | 10-20 days | ฿8,170.00 |
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2500.000 | 10-20 days | ฿27,690.00 |
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Tripropylene Glycol Diacrylate(stabilized with MEHQ)
Tripropylene Glycol Diacrylate (stabilized with MEHQ) is widely used in the production of UV-curable coatings and inks. Its ability to rapidly polymerize under UV light makes it a key component in creating durable, high-performance finishes on various surfaces, including plastics, metals, and paper.
In the electronics industry, it is utilized in the fabrication of photoresists and solder masks, providing precise patterning and protection for circuit boards. Additionally, it serves as a crosslinking agent in adhesives and sealants, enhancing their strength and resistance to environmental factors.
The chemical is also employed in 3D printing resins, enabling the creation of detailed and robust prototypes or end-use parts. Its stabilized form ensures safe handling and storage during these applications.
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