(Chloromethyl)triethoxysilane

98%

  • Product Code: 88039
  Alias:    Chloromethyltriethoxysilane
  CAS:    15267-95-5
Molecular Weight: 212.75 g./mol Molecular Formula: C₇H₁₇ClO₃Si
EC Number: MDL Number: MFCD00039354
Melting Point: Boiling Point: 173-176°C (Lit.)
Density: Storage Condition: 2-8°C, inert gas
Product Description: Used as a coupling agent in the production of hybrid organic-inorganic materials. Enhances adhesion between organic polymers and inorganic surfaces, making it valuable in coatings, adhesives, and sealants. Applied in surface modification to improve the compatibility and performance of fillers in composite materials. Commonly used in the preparation of silica-based nanocomposites for enhanced mechanical properties. Utilized in the synthesis of functionalized silanes for glass treatment, providing water repellency and improved durability. Acts as a precursor in the development of silane-modified polymers, which are essential in construction materials like waterproofing membranes and concrete additives. Also employed in the electronics industry for the surface treatment of semiconductors and other components to enhance performance and stability.
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
5.000 10-20 days ฿495.00
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25.000 10-20 days ฿1,836.00
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100.000 10-20 days ฿5,814.00
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(Chloromethyl)triethoxysilane
Used as a coupling agent in the production of hybrid organic-inorganic materials. Enhances adhesion between organic polymers and inorganic surfaces, making it valuable in coatings, adhesives, and sealants. Applied in surface modification to improve the compatibility and performance of fillers in composite materials. Commonly used in the preparation of silica-based nanocomposites for enhanced mechanical properties. Utilized in the synthesis of functionalized silanes for glass treatment, providing water repellency and improved durability. Acts as a precursor in the development of silane-modified polymers, which are essential in construction materials like waterproofing membranes and concrete additives. Also employed in the electronics industry for the surface treatment of semiconductors and other components to enhance performance and stability.
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