(Chloromethyl)triethoxysilane
98%
- Product Code: 88039
Alias:
Chloromethyltriethoxysilane
CAS:
15267-95-5
Molecular Weight: | 212.75 g./mol | Molecular Formula: | C₇H₁₇ClO₃Si |
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EC Number: | MDL Number: | MFCD00039354 | |
Melting Point: | Boiling Point: | 173-176°C (Lit.) | |
Density: | Storage Condition: | 2-8°C, inert gas |
Product Description:
Used as a coupling agent in the production of hybrid organic-inorganic materials. Enhances adhesion between organic polymers and inorganic surfaces, making it valuable in coatings, adhesives, and sealants.
Applied in surface modification to improve the compatibility and performance of fillers in composite materials. Commonly used in the preparation of silica-based nanocomposites for enhanced mechanical properties.
Utilized in the synthesis of functionalized silanes for glass treatment, providing water repellency and improved durability.
Acts as a precursor in the development of silane-modified polymers, which are essential in construction materials like waterproofing membranes and concrete additives.
Also employed in the electronics industry for the surface treatment of semiconductors and other components to enhance performance and stability.
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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5.000 | 10-20 days | ฿495.00 |
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25.000 | 10-20 days | ฿1,836.00 |
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100.000 | 10-20 days | ฿5,814.00 |
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(Chloromethyl)triethoxysilane
Used as a coupling agent in the production of hybrid organic-inorganic materials. Enhances adhesion between organic polymers and inorganic surfaces, making it valuable in coatings, adhesives, and sealants.
Applied in surface modification to improve the compatibility and performance of fillers in composite materials. Commonly used in the preparation of silica-based nanocomposites for enhanced mechanical properties.
Utilized in the synthesis of functionalized silanes for glass treatment, providing water repellency and improved durability.
Acts as a precursor in the development of silane-modified polymers, which are essential in construction materials like waterproofing membranes and concrete additives.
Also employed in the electronics industry for the surface treatment of semiconductors and other components to enhance performance and stability.
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