4,7-diethoxy-4,7-dimethyl-3,8-dioxa-4,7-disiladecane
97%
- Product Code: 88089
CAS:
18043-74-8
| Molecular Weight: | 294.54 g./mol | Molecular Formula: | C₁₂H₃₀O₄Si₂ |
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| EC Number: | MDL Number: | ||
| Melting Point: | Boiling Point: | 80 °C /1.5 mmHg | |
| Density: | Storage Condition: | 2-8°C, sealed, dry |
Product Description:
This chemical is primarily utilized in the field of materials science, particularly in the development of advanced coatings and surface treatments. It serves as a key component in the formulation of protective layers that enhance the durability and resistance of various substrates to environmental factors such as moisture, UV radiation, and chemical exposure. Additionally, it is employed in the synthesis of specialized polymers and resins, where it contributes to the improvement of thermal stability and mechanical properties. Its unique structure also makes it valuable in the production of adhesives and sealants, offering excellent bonding strength and flexibility. In the electronics industry, it is used in the fabrication of insulating materials and encapsulants, ensuring the reliability and longevity of electronic components.
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 25.000 | 10-20 days | ฿21,600.00 |
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| 100.000 | 10-20 days | ฿72,900.00 |
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4,7-diethoxy-4,7-dimethyl-3,8-dioxa-4,7-disiladecane
This chemical is primarily utilized in the field of materials science, particularly in the development of advanced coatings and surface treatments. It serves as a key component in the formulation of protective layers that enhance the durability and resistance of various substrates to environmental factors such as moisture, UV radiation, and chemical exposure. Additionally, it is employed in the synthesis of specialized polymers and resins, where it contributes to the improvement of thermal stability and mechanical properties. Its unique structure also makes it valuable in the production of adhesives and sealants, offering excellent bonding strength and flexibility. In the electronics industry, it is used in the fabrication of insulating materials and encapsulants, ensuring the reliability and longevity of electronic components.
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