3,3'-(Buta-1,3-diyne-1,4-diyl)dianiline
97%
- Product Code: 94456
CAS:
31661-59-3
| Molecular Weight: | 232.28 g./mol | Molecular Formula: | C₁₆H₁₂N₂ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD06200769 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | 2-8°C, protected from light, dry, sealed |
Product Description:
This chemical is primarily utilized in the synthesis of advanced polymers and organic materials, particularly in the development of conductive polymers and high-performance resins. Its structure, featuring diacetylene and aniline groups, makes it a valuable building block for creating materials with unique electronic properties, such as organic semiconductors used in flexible electronics and optoelectronic devices. Additionally, it serves as a precursor in the production of polyimides, which are employed in high-temperature-resistant coatings, adhesives, and insulating films for aerospace and electronics industries. Its ability to form cross-linked networks also makes it suitable for creating durable and heat-resistant composites.
Product Specification:
| Test | Specification |
|---|---|
| APPEARANCE | Off-White to White Solid |
| PURITY | 96.5-100 |
| Infrared spectrum | Conforms to Structure |
| NMR | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 0.100 | 10-20 days | ฿3,730.00 |
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| 0.250 | 10-20 days | ฿5,520.00 |
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| 1.000 | 10-20 days | ฿13,930.00 |
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| 5.000 | 10-20 days | ฿49,530.00 |
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3,3'-(Buta-1,3-diyne-1,4-diyl)dianiline
This chemical is primarily utilized in the synthesis of advanced polymers and organic materials, particularly in the development of conductive polymers and high-performance resins. Its structure, featuring diacetylene and aniline groups, makes it a valuable building block for creating materials with unique electronic properties, such as organic semiconductors used in flexible electronics and optoelectronic devices. Additionally, it serves as a precursor in the production of polyimides, which are employed in high-temperature-resistant coatings, adhesives, and insulating films for aerospace and electronics industries. Its ability to form cross-linked networks also makes it suitable for creating durable and heat-resistant composites.
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