3,3'-(Buta-1,3-diyne-1,4-diyl)dianiline

97%

  • Product Code: 94456
  CAS:    31661-59-3
Molecular Weight: 232.28 g./mol Molecular Formula: C₁₆H₁₂N₂
EC Number: MDL Number: MFCD06200769
Melting Point: Boiling Point:
Density: Storage Condition: 2-8°C, protected from light, dry, sealed
Product Description: This chemical is primarily utilized in the synthesis of advanced polymers and organic materials, particularly in the development of conductive polymers and high-performance resins. Its structure, featuring diacetylene and aniline groups, makes it a valuable building block for creating materials with unique electronic properties, such as organic semiconductors used in flexible electronics and optoelectronic devices. Additionally, it serves as a precursor in the production of polyimides, which are employed in high-temperature-resistant coatings, adhesives, and insulating films for aerospace and electronics industries. Its ability to form cross-linked networks also makes it suitable for creating durable and heat-resistant composites.
Product Specification:
Test Specification
APPEARANCE Off-White to White Solid
PURITY 96.5-100
Infrared spectrum Conforms to Structure
NMR Conforms to Structure
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
0.100 10-20 days $175.18
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0.250 10-20 days $259.24
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1.000 10-20 days $654.21
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5.000 10-20 days $2,326.13
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3,3'-(Buta-1,3-diyne-1,4-diyl)dianiline
This chemical is primarily utilized in the synthesis of advanced polymers and organic materials, particularly in the development of conductive polymers and high-performance resins. Its structure, featuring diacetylene and aniline groups, makes it a valuable building block for creating materials with unique electronic properties, such as organic semiconductors used in flexible electronics and optoelectronic devices. Additionally, it serves as a precursor in the production of polyimides, which are employed in high-temperature-resistant coatings, adhesives, and insulating films for aerospace and electronics industries. Its ability to form cross-linked networks also makes it suitable for creating durable and heat-resistant composites.
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