4,4'-Diaminodiphenyl sulfone
97%
- Product Code: 126894
Alias:
4,4'-diaminodiphenylsulfone ;4-aminophenylsulfone, dapsone, 4,4'-sulfonyldiphenylamine, bis(4-aminophenyl)sulfone
CAS:
80-08-0
| Molecular Weight: | 248.3 g./mol | Molecular Formula: | C₁₂H₁₂N₂O₂S |
|---|---|---|---|
| EC Number: | 201-248-4 | MDL Number: | MFCD00007887 |
| Melting Point: | 175-177 °C(lit.) | Boiling Point: | |
| Density: | Storage Condition: | Room temperature, dry, sealed |
Product Description:
Used primarily in the production of high-performance polymers, particularly epoxy resins, which are essential in aerospace, automotive, and electronics industries due to their thermal stability and mechanical strength. It serves as a curing agent, enhancing the durability and resistance of these materials under extreme conditions. Additionally, it is employed in the synthesis of polyimide films, which are used in flexible printed circuits and insulation materials. In the pharmaceutical sector, it acts as a precursor in the manufacture of certain antibacterial drugs, particularly for treating leprosy and dermatitis herpetiformis. Its role in these applications highlights its versatility in both industrial and medical fields.
Product Specification:
| Test | Specification |
|---|---|
| Melting Point | 173-181 |
| Purity | 97-100 |
| Appearance | White To Beige Powder Or Crystals |
| Infrared Spectrum | Conforms To Structure |
| Solubility In Hot Methanol | Almost Transparency |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 50.000 | 10-20 days | $18.09 |
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| 100.000 | 10-20 days | $23.60 |
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| 500.000 | 10-20 days | $70.79 |
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| 1000.000 | 10-20 days | $116.40 |
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| 2500.000 | 10-20 days | $274.89 |
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4,4'-Diaminodiphenyl sulfone
Used primarily in the production of high-performance polymers, particularly epoxy resins, which are essential in aerospace, automotive, and electronics industries due to their thermal stability and mechanical strength. It serves as a curing agent, enhancing the durability and resistance of these materials under extreme conditions. Additionally, it is employed in the synthesis of polyimide films, which are used in flexible printed circuits and insulation materials. In the pharmaceutical sector, it acts as a precursor in the manufacture of certain antibacterial drugs, particularly for treating leprosy and dermatitis herpetiformis. Its role in these applications highlights its versatility in both industrial and medical fields.
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