Aminopropyl Terminated Polydimethyl siloxane

Mw 9500-10500

  • Product Code: 133280
  Alias:    Aminopropyl silicone oil
  CAS:    106214-84-0
Molecular Weight: Molecular Formula: H₂N(CH₂)₃Si(CH₃)₂O[Si(CH₃)₂O]nSi(CH₃)₂(CH₂)₃NH₂
EC Number: MDL Number: MFCD00241456
Melting Point: Boiling Point: > 200°C (Lit.)
Density: Storage Condition: 2-8°C, Sealed
Product Description: Widely used as a coupling agent in coatings and adhesives, enhancing adhesion between organic polymers and inorganic surfaces such as glass, metals, and fillers. Its reactive amine groups readily bond with epoxy, acrylic, and other resin systems, making it valuable in sealants and composite materials. Frequently added to silicone-based formulations to improve compatibility with resins and to modify surface properties, such as wetting and dispersion. Also employed in the synthesis of block copolymers and as a surface modifier in silica-filled rubber compounds to reduce viscosity and improve processability. Common in personal care products to provide smoothness and film-forming properties in hair and skin formulations. Used in electronics encapsulation to improve interfacial strength and moisture resistance.
Sizes / Availability / Pricing:
Size Availability Price Quantity
25.000 10-20 days $450.40
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-
5.000 10-20 days $128.01
+
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Aminopropyl Terminated Polydimethyl siloxane
Widely used as a coupling agent in coatings and adhesives, enhancing adhesion between organic polymers and inorganic surfaces such as glass, metals, and fillers. Its reactive amine groups readily bond with epoxy, acrylic, and other resin systems, making it valuable in sealants and composite materials. Frequently added to silicone-based formulations to improve compatibility with resins and to modify surface properties, such as wetting and dispersion. Also employed in the synthesis of block copolymers and as a surface modifier in silica-filled rubber compounds to reduce viscosity and improve processability. Common in personal care products to provide smoothness and film-forming properties in hair and skin formulations. Used in electronics encapsulation to improve interfacial strength and moisture resistance.
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