Trihydroxysilylethyl phenylsulphonic acid
97%, 25% in H2O
- Product Code: 238565
CAS:
143282-00-2
| Molecular Weight: | 264.33 g./mol | Molecular Formula: | C₈H₁₂O₆SSi |
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| EC Number: | MDL Number: | ||
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| Density: | Storage Condition: | 2-8°C |
Product Description:
Used as a coupling agent in silicone-based formulations to improve adhesion between organic and inorganic materials. Enhances durability and stability in coatings, sealants, and adhesives exposed to moisture or high temperatures. Commonly applied in construction materials and electronic encapsulants where strong interfacial bonding is critical. Also utilized in composite systems to improve dispersion of fillers and reinforce mechanical properties.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 5.000 | 10-20 days | $1,064.42 |
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Trihydroxysilylethyl phenylsulphonic acid
Used as a coupling agent in silicone-based formulations to improve adhesion between organic and inorganic materials. Enhances durability and stability in coatings, sealants, and adhesives exposed to moisture or high temperatures. Commonly applied in construction materials and electronic encapsulants where strong interfacial bonding is critical. Also utilized in composite systems to improve dispersion of fillers and reinforce mechanical properties.
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