THPN
≥98%(HPLC)
- Product Code: 244859
CAS:
100079-26-3
| Molecular Weight: | 266.33 g./mol | Molecular Formula: | C₁₅H₂₂O₄ |
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| EC Number: | MDL Number: | ||
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| Density: | Storage Condition: | 2-8°C, sealed, dry |
Product Description:
Used as a curing agent in epoxy resin systems, particularly in high-performance coatings and electrical encapsulation. Offers excellent thermal stability and chemical resistance, making it suitable for applications in the electronics and aerospace industries. Also utilized in composite materials where durability under extreme conditions is required.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 0.005 | 10-20 days | $255.68 |
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THPN
Used as a curing agent in epoxy resin systems, particularly in high-performance coatings and electrical encapsulation. Offers excellent thermal stability and chemical resistance, making it suitable for applications in the electronics and aerospace industries. Also utilized in composite materials where durability under extreme conditions is required.
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