3-(Trichlorosilyl)propyl acrylate
97%
- Product Code: 88220
CAS:
38595-89-0
| Molecular Weight: | 247.58 g./mol | Molecular Formula: | C₆H₉Cl₃O₂Si |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00054832 | |
| Melting Point: | 71 °C | Boiling Point: | 68 °C /0.4 mmHg |
| Density: | Storage Condition: | -20°C, sealed, dry |
Product Description:
This chemical is widely used as a coupling agent in the production of composite materials, particularly in enhancing the adhesion between organic polymers and inorganic surfaces. It is applied in the manufacturing of coatings, adhesives, and sealants to improve durability and resistance to environmental factors. Additionally, it plays a key role in the modification of silica nanoparticles, enabling their effective dispersion in polymer matrices for advanced materials like reinforced plastics. In the dental industry, it is utilized to strengthen the bond between dental composites and tooth surfaces, ensuring long-lasting restorative solutions. Its application in the electronics sector includes improving the performance of encapsulants and coatings for electronic components.
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 5.000 | 10-20 days | ฿4,203.00 |
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| 25.000 | 10-20 days | ฿14,679.00 |
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3-(Trichlorosilyl)propyl acrylate
This chemical is widely used as a coupling agent in the production of composite materials, particularly in enhancing the adhesion between organic polymers and inorganic surfaces. It is applied in the manufacturing of coatings, adhesives, and sealants to improve durability and resistance to environmental factors. Additionally, it plays a key role in the modification of silica nanoparticles, enabling their effective dispersion in polymer matrices for advanced materials like reinforced plastics. In the dental industry, it is utilized to strengthen the bond between dental composites and tooth surfaces, ensuring long-lasting restorative solutions. Its application in the electronics sector includes improving the performance of encapsulants and coatings for electronic components.
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