3,9-Di(cyclohex-3-en-1-yl)-2,4,8,10-tetraoxaspiro[5.5]undecane
≥95%
- Product Code: 117351
CAS:
6600-31-3
| Molecular Weight: | 320.42 g./mol | Molecular Formula: | C₁₉H₂₈O₄ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00023815 | |
| Melting Point: | Boiling Point: | 441.7°C at 760 mmHg | |
| Density: | 1.14g/cm3 | Storage Condition: | room temperature, stored under inert gas |
Product Description:
This chemical is primarily utilized as a reactive diluent in the formulation of epoxy resins. It helps in reducing the viscosity of the resin, making it easier to handle and apply, particularly in coatings, adhesives, and composite materials. Its incorporation enhances the mechanical properties and thermal stability of the final product. Additionally, it is employed in UV-curable systems, where it contributes to faster curing times and improved surface finish. The compound's structure also makes it suitable for use in high-performance applications requiring durability and resistance to environmental factors.
Product Specification:
| Test | Specification |
|---|---|
| Appearance | White To Yellow Powder Or Crystals |
| Purity (%) | 94.5-100 |
| Infrared Spectrum | Conforms To Structure |
| NMR | Conforms To Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 5.000 | 10-20 days | $9.90 |
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| 25.000 | 10-20 days | $19.80 |
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| 100.000 | 10-20 days | $59.41 |
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| 500.000 | 10-20 days | $178.22 |
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3,9-Di(cyclohex-3-en-1-yl)-2,4,8,10-tetraoxaspiro[5.5]undecane
This chemical is primarily utilized as a reactive diluent in the formulation of epoxy resins. It helps in reducing the viscosity of the resin, making it easier to handle and apply, particularly in coatings, adhesives, and composite materials. Its incorporation enhances the mechanical properties and thermal stability of the final product. Additionally, it is employed in UV-curable systems, where it contributes to faster curing times and improved surface finish. The compound's structure also makes it suitable for use in high-performance applications requiring durability and resistance to environmental factors.
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