10-(2,5-Dihydroxyphenyl)-10H-9-oxa-10-phospha-phenantbrene-10-oxide
≥98%
- Product Code: 120391
CAS:
99208-50-1
Molecular Weight: | 324.271 g./mol | Molecular Formula: | C₁₈H₁₃O₄P |
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EC Number: | MDL Number: | MFCD10566780 | |
Melting Point: | 245-255ºC | Boiling Point: | 592.882ºC at 760 mmHg |
Density: | 1.498 | Storage Condition: | Room temperature, sealed, dry |
Product Description:
This compound is primarily utilized as a flame retardant in various polymer materials, particularly in epoxy resins and polycarbonates. Its unique structure allows it to enhance fire resistance by promoting char formation and reducing the release of flammable gases during combustion. Additionally, it is employed in the electronics industry to improve the safety of circuit boards and other components by minimizing fire hazards. Its application extends to coatings and adhesives, where it contributes to thermal stability and fire protection without significantly compromising the material's mechanical properties.
Product Specification:
Test | Specification |
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Appearance | Solid |
Purity (%) | 97.5-100 |
Infrared Spectrum | Conforms To Structure |
NMR | Conforms To Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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25.000 | 10-20 days | ฿1,470.00 |
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100.000 | 10-20 days | ฿4,870.00 |
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500.000 | 10-20 days | ฿17,100.00 |
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10-(2,5-Dihydroxyphenyl)-10H-9-oxa-10-phospha-phenantbrene-10-oxide
This compound is primarily utilized as a flame retardant in various polymer materials, particularly in epoxy resins and polycarbonates. Its unique structure allows it to enhance fire resistance by promoting char formation and reducing the release of flammable gases during combustion. Additionally, it is employed in the electronics industry to improve the safety of circuit boards and other components by minimizing fire hazards. Its application extends to coatings and adhesives, where it contributes to thermal stability and fire protection without significantly compromising the material's mechanical properties.
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