2-((4-((2-Isopropoxyethoxy)methyl)phenoxy)methyl)oxirane
95%
- Product Code: 121722
CAS:
66722-57-4
| Molecular Weight: | 266.33 g./mol | Molecular Formula: | C₁₅H₂₂O₄ |
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| EC Number: | MDL Number: | MFCD12024632 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | 2-8°C, dry, airtight |
Product Description:
This chemical is primarily utilized in the development of advanced epoxy resins, which are widely applied in coatings, adhesives, and composite materials. Its unique structure allows for enhanced flexibility and adhesion properties, making it suitable for use in high-performance industrial and automotive coatings. Additionally, it serves as a key intermediate in the synthesis of specialty polymers, contributing to improved thermal stability and chemical resistance in final products. Its application in electronics is also notable, where it is used in encapsulants and insulating materials to ensure durability and reliability in harsh environments.
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 0.100 | 10-20 days | ฿4,905.00 |
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| 0.250 | 10-20 days | ฿8,163.00 |
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| 1.000 | 10-20 days | ฿16,344.00 |
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2-((4-((2-Isopropoxyethoxy)methyl)phenoxy)methyl)oxirane
This chemical is primarily utilized in the development of advanced epoxy resins, which are widely applied in coatings, adhesives, and composite materials. Its unique structure allows for enhanced flexibility and adhesion properties, making it suitable for use in high-performance industrial and automotive coatings. Additionally, it serves as a key intermediate in the synthesis of specialty polymers, contributing to improved thermal stability and chemical resistance in final products. Its application in electronics is also notable, where it is used in encapsulants and insulating materials to ensure durability and reliability in harsh environments.
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