Triethylene Glycol Divinyl Ether
≥98%, with stabilizer KOH
- Product Code: 121817
Alias:
Tri(ethylene glycol) divinyl ether;Triethyleneglycol divinyl ether
CAS:
765-12-8
Molecular Weight: | 202.25 g./mol | Molecular Formula: | C₁₀H₁₈O₄ |
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EC Number: | MDL Number: | MFCD00074891 | |
Melting Point: | Boiling Point: | 126°C/18mmHg(lit.) | |
Density: | Storage Condition: | room temperature |
Product Description:
Triethylene Glycol Divinyl Ether is primarily used as a reactive diluent in the production of polymers and coatings. It enhances the flexibility and durability of the final product, making it suitable for applications in adhesives, sealants, and paints. Its ability to copolymerize with other monomers allows for the creation of materials with tailored properties, such as improved chemical resistance and thermal stability. Additionally, it is employed in the synthesis of specialty chemicals and as a crosslinking agent in the manufacture of high-performance resins. Its versatility also extends to the electronics industry, where it is used in the production of photoresists and insulating materials.
Product Specification:
Test | Specification |
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Purity (GC) | 97.5-100 |
Specific Gravity (20/20) | 1.002-1.006 |
Refractive Index N20/D | 1.451-1.455 |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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1.000 | 10-20 days | ฿250.00 |
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5.000 | 10-20 days | ฿300.00 |
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25.000 | 10-20 days | ฿460.00 |
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100.000 | 10-20 days | ฿1,280.00 |
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500.000 | 10-20 days | ฿4,450.00 |
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Triethylene Glycol Divinyl Ether
Triethylene Glycol Divinyl Ether is primarily used as a reactive diluent in the production of polymers and coatings. It enhances the flexibility and durability of the final product, making it suitable for applications in adhesives, sealants, and paints. Its ability to copolymerize with other monomers allows for the creation of materials with tailored properties, such as improved chemical resistance and thermal stability. Additionally, it is employed in the synthesis of specialty chemicals and as a crosslinking agent in the manufacture of high-performance resins. Its versatility also extends to the electronics industry, where it is used in the production of photoresists and insulating materials.
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