Neopentyl Glycol Bis(4-aminophenyl) Ether
≥97%
- Product Code: 122721
CAS:
115570-52-0
| Molecular Weight: | 286.38 g./mol | Molecular Formula: | C₁₇H₂₂N₂O₂ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00671569 | |
| Melting Point: | 115-119°C | Boiling Point: | |
| Density: | Storage Condition: | room temperature |
Product Description:
Neopentyl Glycol Bis(4-aminophenyl) Ether is primarily utilized in the synthesis of high-performance polymers and resins. It serves as a key monomer in the production of polyimides, which are known for their exceptional thermal stability, mechanical strength, and chemical resistance. These polyimides are widely used in the electronics industry for manufacturing flexible printed circuit boards, insulating films, and coatings for semiconductors. Additionally, the compound is employed in the development of epoxy resins, enhancing their durability and heat resistance, making them suitable for aerospace, automotive, and industrial applications. Its role in creating advanced materials contributes significantly to innovations in high-temperature and high-stress environments.
Product Specification:
| Test | Specification |
|---|---|
| Appearance | White To Light Yellow To Light Orange To Brown Powder To Crystals |
| Purity (%) | 96.5-100 |
| Melting Point (Degree Celsius) | 115-119 |
| Infrared Spectrum | Conforms To Structure |
| NMR | Conforms To Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 1.000 | 10-20 days | Ft9,588.96 |
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| 5.000 | 10-20 days | Ft19,285.65 |
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| 25.000 | 10-20 days | Ft74,880.05 |
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Neopentyl Glycol Bis(4-aminophenyl) Ether
Neopentyl Glycol Bis(4-aminophenyl) Ether is primarily utilized in the synthesis of high-performance polymers and resins. It serves as a key monomer in the production of polyimides, which are known for their exceptional thermal stability, mechanical strength, and chemical resistance. These polyimides are widely used in the electronics industry for manufacturing flexible printed circuit boards, insulating films, and coatings for semiconductors. Additionally, the compound is employed in the development of epoxy resins, enhancing their durability and heat resistance, making them suitable for aerospace, automotive, and industrial applications. Its role in creating advanced materials contributes significantly to innovations in high-temperature and high-stress environments.
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