Amine Curing agent
Aliphatic, amine value: 900~1035mgKOH/g, viscosity (25℃): 160~280mpa.s
- Product Code: 136581
Alias:
Supporting products: Epoxy resin, E-44, Epoxy resin, E-51, Epoxy resin, E-42; Aliphatic amine curing agent; Aliphatic epoxy resin curing agent
Properties:
The epoxy resin must be added to make the linear molecules react and cross-link them into huge molecules with a network structure, and become a thermoset epoxy resin cured product, thus showing its excellent performance. Depending on different models, different types of epoxy curing agents, the curing effect and curing time are different.
| Molecular Weight: | Molecular Formula: | ||
|---|---|---|---|
| EC Number: | MDL Number: | ||
| Melting Point: | Boiling Point: | ||
| Density: | 1.01g/ml（25℃） | Storage Condition: | Room temperature |
Product Description:
Used primarily in epoxy resin systems to initiate and control the curing process, enabling the formation of durable, chemically resistant, and mechanically strong networks. Widely applied in coatings, adhesives, sealants, and composite materials for industries such as automotive, aerospace, construction, and electronics. Offers excellent adhesion to various substrates and can be tailored for room temperature or elevated temperature curing. Provides good moisture resistance and electrical insulation properties, making it suitable for protective coatings and encapsulation of electronic components. Some formulations are designed for low volatility and reduced skin irritation, supporting safer handling in industrial and field applications.
Product Specification:
| Test | Specification |
|---|---|
| Appearance | Colorless to light yellow liquid |
| Amine Value | 900-1035 mg KOH/g |
| Viscosity (25°C) | 160-280 mPa.s |
| Infrared Spectrum | Conforms to Structure |
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 250g | 10-20 days | $82.66 |
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| 1kg | 10-20 days | $239.36 |
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Amine Curing agent
Used primarily in epoxy resin systems to initiate and control the curing process, enabling the formation of durable, chemically resistant, and mechanically strong networks. Widely applied in coatings, adhesives, sealants, and composite materials for industries such as automotive, aerospace, construction, and electronics. Offers excellent adhesion to various substrates and can be tailored for room temperature or elevated temperature curing. Provides good moisture resistance and electrical insulation properties, making it suitable for protective coatings and encapsulation of electronic components. Some formulations are designed for low volatility and reduced skin irritation, supporting safer handling in industrial and field applications.
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