Bis(ethoxydimethylsilyl)methane
97%
- Product Code: 141623
CAS:
17887-25-1
Molecular Weight: | 220.46 g./mol | Molecular Formula: | C₉H₂₄O₂Si₂ |
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EC Number: | MDL Number: | ||
Melting Point: | Boiling Point: | 82 °C at 25 mmHg | |
Density: | Storage Condition: | 2-8°C |
Product Description:
Used as a crosslinking agent in silicone curing systems, especially in moisture-cure sealants and adhesives. Enhances adhesion to various substrates without primers and improves the durability of the final product. Commonly applied in construction sealants, automotive assemblies, and electronic encapsulation due to its ability to form stable, flexible silicone networks. Also functions as a surface modifier in coatings, providing water repellency and improved weather resistance.
Sizes / Availability / Pricing:
Size | Availability | Price | Quantity |
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1g | 10-20 days | ฿23,850.00 |
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Bis(ethoxydimethylsilyl)methane
Used as a crosslinking agent in silicone curing systems, especially in moisture-cure sealants and adhesives. Enhances adhesion to various substrates without primers and improves the durability of the final product. Commonly applied in construction sealants, automotive assemblies, and electronic encapsulation due to its ability to form stable, flexible silicone networks. Also functions as a surface modifier in coatings, providing water repellency and improved weather resistance.
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