1,3-Bis(3-aminophenoxy)benzene
98%,LC&T
- Product Code: 146798
CAS:
10526-07-5
| Molecular Weight: | 292.33 g./mol | Molecular Formula: | C₁₈H₁₆N₂O₂ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00043718 | |
| Melting Point: | 108°C | Boiling Point: | 479.9°C |
| Density: | 1.243g/cm3 | Storage Condition: | Room temperature |
Product Description:
Used as a curing agent and crosslinking agent in high-performance epoxy resins, particularly in aerospace and electronics industries due to its ability to form thermally stable and mechanically strong networks. Its structural flexibility and aromatic content contribute to improved toughness and thermal resistance in cured resins. Also employed in the synthesis of advanced polyimides and polyurethanes where thermal stability and dimensional stability are critical. Commonly found in composite materials, encapsulants, and adhesives requiring long-term performance under high-temperature conditions.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 1g | 10-20 days | ฿310.00 |
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| 5g | 10-20 days | ฿1,130.00 |
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| 25g | 10-20 days | ฿3,980.00 |
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| 100g | 10-20 days | ฿11,450.00 |
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1,3-Bis(3-aminophenoxy)benzene
Used as a curing agent and crosslinking agent in high-performance epoxy resins, particularly in aerospace and electronics industries due to its ability to form thermally stable and mechanically strong networks. Its structural flexibility and aromatic content contribute to improved toughness and thermal resistance in cured resins. Also employed in the synthesis of advanced polyimides and polyurethanes where thermal stability and dimensional stability are critical. Commonly found in composite materials, encapsulants, and adhesives requiring long-term performance under high-temperature conditions.
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