3,3'-([1,1'-Biphenyl]-4,4'-diylbis(oxy))dianiline
95%
- Product Code: 149704
CAS:
105112-76-3
Molecular Weight: | 368.43 g./mol | Molecular Formula: | |
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EC Number: | MDL Number: | MFCD00357502 | |
Melting Point: | 144 °C (lit.) | Boiling Point: | |
Density: | 1.23 g/cm3 at 25 °C (lit.) | Storage Condition: | Room temperature |
Product Description:
Used as a high-performance diamine monomer in the synthesis of polyimides and polyamides, offering excellent thermal stability and mechanical strength. Commonly applied in aerospace, electronics, and semiconductor industries for manufacturing heat-resistant coatings, flexible printed circuits, and insulating materials. Its rigid molecular structure enhances the glass transition temperature and dimensional stability of resulting polymers, making it suitable for demanding environments requiring long-term reliability. Also utilized in advanced composite materials and as a crosslinking agent in specialty resins.
Product Specification:
Test | Specification |
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Appearance | White to Light yellow to Light orange powder to crystal |
Purity (%) | 94.5-100 |
Infrared Spectrum | Conforms to Structure |
NMR | Conforms to Structure |
Sizes / Availability / Pricing:
Size | Availability | Price | Quantity |
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1g | 10-20 days | ฿1,620.00 |
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5g | 10-20 days | ฿5,890.00 |
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25g | 10-20 days | ฿23,000.00 |
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100g | 10-20 days | ฿48,060.00 |
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3,3'-([1,1'-Biphenyl]-4,4'-diylbis(oxy))dianiline
Used as a high-performance diamine monomer in the synthesis of polyimides and polyamides, offering excellent thermal stability and mechanical strength. Commonly applied in aerospace, electronics, and semiconductor industries for manufacturing heat-resistant coatings, flexible printed circuits, and insulating materials. Its rigid molecular structure enhances the glass transition temperature and dimensional stability of resulting polymers, making it suitable for demanding environments requiring long-term reliability. Also utilized in advanced composite materials and as a crosslinking agent in specialty resins.
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