Copper(I) hexafluoro-2,4-pentanedionate 2-butyne complex
- Product Code: 157127
CAS:
137007-13-7
Molecular Weight: | 324.69 g./mol | Molecular Formula: | C₉H₇CuF₆O₂ |
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EC Number: | MDL Number: | ||
Melting Point: | 68-73 °C | Boiling Point: | 40 °C at 0.1 mmHg |
Density: | Storage Condition: | 2-8°C |
Product Description:
Used as a precursor in metal-organic chemical vapor deposition (MOCVD) for depositing copper thin films in semiconductor manufacturing. Its volatility and thermal stability allow for precise, low-temperature deposition, making it suitable for advanced microelectronic devices where copper acts as a conductive layer. The complex helps achieve high-purity, uniform coatings essential in integrated circuits and printed circuit boards. It is favored in applications requiring minimal carbon contamination due to its clean decomposition profile.
Sizes / Availability / Pricing:
Size | Availability | Price | Quantity |
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1g | 10-20 days | ฿35,990.00 |
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Copper(I) hexafluoro-2,4-pentanedionate 2-butyne complex
Used as a precursor in metal-organic chemical vapor deposition (MOCVD) for depositing copper thin films in semiconductor manufacturing. Its volatility and thermal stability allow for precise, low-temperature deposition, making it suitable for advanced microelectronic devices where copper acts as a conductive layer. The complex helps achieve high-purity, uniform coatings essential in integrated circuits and printed circuit boards. It is favored in applications requiring minimal carbon contamination due to its clean decomposition profile.
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