Dicyclopentadiene diepoxide
97%
- Product Code: 169633
Alias:
Dicyclopentadiene dioxide; Dicyclopentadiene diepoxide
CAS:
81-21-0
Properties:
Soluble in water
Molecular Weight: | 164.2 g./mol | Molecular Formula: | C₁₀H₁₂O₂ |
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EC Number: | 201-334-1 | MDL Number: | MFCD00077209 |
Melting Point: | 185-189 °C(lit.) | Boiling Point: | 326 °C |
Density: | 1.331 g/cm3 | Storage Condition: | Room temperature, dry, sealed |
Product Description:
Used primarily as a reactive diluent and modifier in epoxy resin systems, enhancing flexibility and reducing viscosity without compromising chemical resistance. Commonly applied in high-performance coatings, adhesives, and composite materials where improved toughness and thermal stability are required. Its rigid molecular structure contributes to superior mechanical strength in cured epoxies, making it suitable for aerospace, electronics encapsulation, and structural adhesives. Also utilized in specialty polymers and crosslinking agents for advanced material formulations.
Product Specification:
Test | Specification |
---|---|
Epoxy Value | 12.1-12.2 eq/kg |
Purity (GC) | 97-100% |
Appearance | White powder or solid |
Infrared Spectrum | Conforms to Structure |
Proton NMR Spectrum | Conforms to Structure |
Sizes / Availability / Pricing:
Size | Availability | Price | Quantity |
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1g | 10-20 days | ฿1,300.00 |
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25g | 10-20 days | ฿13,990.00 |
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100g | 10-20 days | ฿39,470.00 |
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500g | 10-20 days | ฿118,500.00 |
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5g | 10-20 days | ฿4,180.00 |
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Dicyclopentadiene diepoxide
Used primarily as a reactive diluent and modifier in epoxy resin systems, enhancing flexibility and reducing viscosity without compromising chemical resistance. Commonly applied in high-performance coatings, adhesives, and composite materials where improved toughness and thermal stability are required. Its rigid molecular structure contributes to superior mechanical strength in cured epoxies, making it suitable for aerospace, electronics encapsulation, and structural adhesives. Also utilized in specialty polymers and crosslinking agents for advanced material formulations.
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