1,2-Diphenyl-1,2-bis(4-(4,4,5,5-tetramethyl-1,3,2-dioxaborolan-2-yl)phenyl)ethene
97%
- Product Code: 178049
CAS:
2095541-89-0
| Molecular Weight: | 584.36 g./mol | Molecular Formula: | C₃₈H₄₂B₂O₄ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD31619168 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | Room temperature, light-proof, inert gas |
Product Description:
Used as a key intermediate in Suzuki-Miyaura cross-coupling reactions for the synthesis of conjugated organic materials. It enables the construction of extended π-conjugated systems used in organic electronics, such as organic light-emitting diodes (OLEDs), organic field-effect transistors (OFETs), and molecular wires. The boronate ester groups allow for efficient and selective coupling with aryl halides under palladium catalysis, making it valuable in the preparation of complex aromatic frameworks for optoelectronic applications. Its rigid ethene backbone supports planarity and electronic communication across the molecule, enhancing charge transport properties in thin-film devices.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
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| 250mg | 10-20 days | ฿2,690.00 |
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| 1g | 10-20 days | ฿4,560.00 |
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| 5g | 10-20 days | ฿18,980.00 |
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| 25g | 10-20 days | ฿82,380.00 |
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1,2-Diphenyl-1,2-bis(4-(4,4,5,5-tetramethyl-1,3,2-dioxaborolan-2-yl)phenyl)ethene
Used as a key intermediate in Suzuki-Miyaura cross-coupling reactions for the synthesis of conjugated organic materials. It enables the construction of extended π-conjugated systems used in organic electronics, such as organic light-emitting diodes (OLEDs), organic field-effect transistors (OFETs), and molecular wires. The boronate ester groups allow for efficient and selective coupling with aryl halides under palladium catalysis, making it valuable in the preparation of complex aromatic frameworks for optoelectronic applications. Its rigid ethene backbone supports planarity and electronic communication across the molecule, enhancing charge transport properties in thin-film devices.
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