1,2-Epoxy-3-(3-methylphenoxypropane)
95%
- Product Code: 184701
CAS:
2186-25-6
| Molecular Weight: | 164.2 g./mol | Molecular Formula: | C₁₀H₁₂O₂ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00046990 | |
| Melting Point: | Boiling Point: | 139.5-140.5 °C | |
| Density: | 1.0801 g/cm3 | Storage Condition: | Room temperature, inert gas |
Product Description:
Used as a reactive diluent in epoxy resin systems to reduce viscosity while maintaining thermal and mechanical properties. Enhances workability in coatings, adhesives, and composite formulations. Commonly employed in electrical encapsulation and casting due to its good dielectric properties and compatibility with various curing agents. Also utilized in specialty resins where improved flexibility and moisture resistance are required.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 5g | 10-20 days | ฿8,950.00 |
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| 25g | 10-20 days | ฿36,500.00 |
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| 1g | 10-20 days | ฿2,450.00 |
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1,2-Epoxy-3-(3-methylphenoxypropane)
Used as a reactive diluent in epoxy resin systems to reduce viscosity while maintaining thermal and mechanical properties. Enhances workability in coatings, adhesives, and composite formulations. Commonly employed in electrical encapsulation and casting due to its good dielectric properties and compatibility with various curing agents. Also utilized in specialty resins where improved flexibility and moisture resistance are required.
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